European Packaging, Assembly, and Test – Workshop
European Packaging, Assembly, and Test – Workshop
Aiming at facilitating mutual engagement, the European Packaging, Assembly, and Test – Workshop will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts along the complete semiconductor packaging supply chain, to collectively strengthen the semiconductor packaging eco-system in Europe.
1st EuroPAT-Workshop, September 18-19, 2021, Hof, Germany
Organized by SEMI Europe, Hosted by Micro Systems Engineering GmbH (an MST Group company)
2nd EuroPAT-Workshop, September 6-7, 2023, Nijmegen, The Netherlands
Organized and hosted by Sencio B.V.
3rd EuroPAT-Workshop, September 9-10, 2024, Berlin, Germany
Organized by SEMI Europe, Hosted by Swissbit Germany AG
